Precision Engineered 3D Multilayered Copper–Polymer Microstructures through Integrated Framework Fabrication

Abstract

Abstract 3D multilayered conductive microstructures are essential for advanced electronic materials, heterogeneous integration, and next-generation interconnect architectures. However, fabricating high-fidelity multilayered metallic composites remains challenging due to the limitations of existing methods, process complexity, and high cost. Here, we present a patented fabrication strategy based on advanced membrane nanotechnology for developing multilayered copper microstructures. The method uses engineered isoporous polymeric templates as structural scaffolds that guide the in situ and monolithic growth of copper across multiple layers. This approach enables control over copper–polymer layer composition and geometry, as demonstrated with multilayered architectures containing up to 10 distinct layers, with the potential for even more complex configurations. Structural and interfacial characterization confirms continuous copper growth, coherent interfaces, oxide-free copper regions, and through-thickness electrical communication across the multilayer architecture. Compared with conventional repeated layer-by-layer semiconductor fabrication routes, the proposed approach simplifies multilayer construction and shows potential to reduce electrochemical deposition time compared to traditional semiconductor methods. This methodology broadens the design space for developing customizable, rapidly manufactured microstructured materials for applications requiring high structural integrity.