Shuhang Lyu

Precision Engineered 3D Multilayered Copper–Polymer Microstructures through Integrated Framework Fabrication

Abstract 3D multilayered conductive microstructures are essential for advanced electronic materials, heterogeneous integration, and next-generation interconnect architectures. However, fabricating high-fidelity multilayered metallic composites remains challenging due to the limit...

Experimental Evidence for the Impact of Copper Microstructure on Residual Stress of Through Silicon Via

ABSTRACT Three‐dimensional integrated circuits (3DICs) with Cu through silicon vias (TSVs) offer improved system performance beyond front‐end‐of‐line scaling. However, the residual thermal stress imparted by TSVs on the surrounding silicon raises reliability concerns. This stress...