Synthesis and Curing of Tetra-Component Phenolic Resin as a Candidate Resin for Further Investigation in Photoresist Formulations

Abstract

The paper describes the synthesis and properties of a tetra-component phenolic resin as a candidate resin for further investigation in photoresist formulations, and its oligomer was synthesized via addition, condensation, and polycondensation reactions. Characterization was conducted using infrared spectroscopy, nuclear magnetic resonance, and gel permeation chromatography. The tetra-component phenolic resin has a weight-average molecular weight of 6376 g/mol and an average alkali solubility rate of 159 ± 2.16 Å/s. Acid-catalyzed crosslinking of HMMM and phenolic resin were used to simulate the crosslinking process of a novolac negative photoresist induced by photoacid. The results indicate that this tetra-component phenolic resin preliminarily meets the requirements for photoresist film formation and could have the opportunity to be used as a candidate resin for further investigation in photoresist formulations.