Photonic Integrated Circuit Platform on 3 μm Thick Silicon‐on‐Insulator and Its Application Examples

Abstract

ABSTRACT This paper gives an overview of the 3 μm SOI PIC platform and explains its unique characteristics, such as ultra‐high mode confinement, low losses, dense integration, polarization‐independent operation, small phase errors, ultra‐broadband operation, and ability to handle relatively large optical powers. Examples of monolithically integrated passive and active waveguide components are given, including couplers, wavelength (de)multiplexers, phase modulators, and Ge photodiodes. Hybrid integration and packaging possibilities are briefly addressed. As examples of potential applications, some results are provided for tunable lasers, optical beam steering, medical imaging, and RF beam steering. Ongoing and targeted developments for this PIC platform are also briefly discussed, and a comparison to some alternative PIC platforms is made. Access to this technology in VTT’s Micronova cleanroom with 200 mm wafer size is supported by process design kits and the PIXEurope pilot line.