Jae Wung Lee

Photonic Integrated Circuit Platform on 3 μm Thick Silicon‐on‐Insulator and Its Application Examples

ABSTRACT This paper gives an overview of the 3 μm SOI PIC platform and explains its unique characteristics, such as ultra‐high mode confinement, low losses, dense integration, polarization‐independent operation, small phase errors, ultra‐broadband operation, and ability to handle...