Nano‑Ni-based multi-channel recyclable thermal interface material with dual-mode interface adaptability

Abstract

The rapid miniaturization and integration of electronic devices demand highly efficient thermal management while concurrently exacerbating the global electronic waste (e-waste) crisis. Although thermal interface materials (TIMs) are important for heat dissipation, their end-of-life recycling remains a formidable challenge due to stable polymers usually serve as an essential component. Herein, we develop a polymer-grafted Nickel nanoparticles as thermal interface paste (DAMF-Ni) that features dual-mode interface conformability and multi-pathway recyclability. By integrating phase-change polymer segments onto the surface of nickel nanoparticles via reversible covalent bonds, DAMF-Ni achieves enhanced interfacial adaptability through melt infiltration and magnetic-induced attachment, while enabling both chemical and physical recycling via dynamic reactions and magnetic force. Consequently, the material exhibits a remarkably low thermal contact resistance of 0.61 cm² K W⁻¹, enabling a maximum temperature reduction of 27.3 °C at the device interface. Also, its core-shell polymer brush structure allows for upcycling into nanofluids and phase-change composites after end-of-life, demonstrating attractive potential in liquid cooling and thermal storage applications. This work not only broadens the design paradigm of TIMs with interface adaptability but also establishes a sustainable paradigm for mitigating e-waste in thermal management systems.