Challenges and strategies toward next‐generation high‐performance flexible and printable thin‐film transistors

Abstract

Abstract Printing‐based fabrication is emerging as a viable alternative to vacuum microfabrication for flexible thin‐film transistors (TFTs), enabling low‐cost, scalable, and low‐temperature manufacturing for additive processing and large‐area electronics. In this review, we summarize recent advances in key printing strategies, including inkjet printing, screen printing, liquid metal printing, and roll‐to‐roll processing. We then critically examine flexible and printable TFTs from a device‐architecture perspective, focusing on the printed formation of substrates, electrodes, dielectric layers, and semiconductor channels, and clarifying how process and material choices dictate electrical performance and operational stability. Representative application scenarios are briefly highlighted to demonstrate the growing technological relevance of printed TFT platforms. Finally, we discuss the major bottlenecks limiting device uniformity, integration density, and manufacturing reliability, and provide an outlook on emerging materials, process innovations, and scalable architectures toward high‐performance, fully printed TFT technologies for future flexible electronics.