Engineering & Technologyarticle2026-08-21

Cold Fusion SLS Powder Binders for CMF, CCF, CPF and CEPF - the 3Dresyns Powder-Binder Family

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Abstract

This white paper covers the 3Dresyns Cold Fusion SLS powder-binder family for CMF, CCF, CPF and CEPF routes: a binder-assisted, mould-free indirect sintering route on standard SLS hardware, where the laser fuses a co-binder — or, with the self-sufficient CF3, the binder itself — to form the green part, and final density comes from conventional thermal sintering. Cold Fusion SLS uses a three-role blend: a water- or solvent-soluble binder (CF grade) removed by debinding, a laser-fusible co-binder that builds the green part, and an optional crosslinked PMMA pore former for controlled porosity. The co-binder follows the debinding route — PLA20-80 for the water routes (CF2, CF4) and Nylon for the CF1 solvent route. Two exceptions apply: CF3 SD Bio is self-sufficient and uses no co-binder, since its ultra-low melting point lets the laser fuse it directly on a cold bed; and Cold Polymer Fusion (CF5, for PEEK/PEKK) pairs CF5 with the water-soluble CF2 binder and uses no Nylon, because Nylon degrades above the PEEK/PEKK sintering window. Bed temperature follows the fusible phase, not a fixed low value.

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View paper (DOI)Open access versionOpenAlexZenodo (CERN European Organization for Nuclear Research)Published 2026-08-21

Authors: Juan Segurola

Institutions: Dynavax Technologies (Germany)