Micron (United States)

Integrated experimental-numerical characterization of thickness and loading condition effects on mechanical properties in copper thin films

Copper (Cu) thin films are critical interconnect materials in advanced semiconductor interconnect and packaging applications, where mechanical reliability under loading conditions relevant to semiconductor manufacturing and packaging becomes increasingly important with continued...

Full-Range Ultrasensitive Fiber-Optic Hydrogen Detection via Twin Vernier Amplification and Lightweight CNN

Reliable hydrogen monitoring requires sensors that combine high sensitivity, wide dynamic range, and resistance to environmental interference. Here, we report a monolithically integrated dual-Fabry-Pérot interferometer (dual-FPI) fiber-optic hydrogen sensor that couples twin Vern...