Hisense (China)

Liquid metal enables compatible through-plane thermal transport and microwave absorption in flexible PDMS composite

Thermal interface materials combining high thermal conductivity with microwave-absorption capability are increasingly required for 5G communication modules, flexible electronics, and aerospace electronic systems, especially as chip sizes shrink and integration density increases....

Thermo-mechanically driven dynamic recovery and residual stress relaxation in high-efficiency deep grinding of single-crystal superalloys

High-efficiency deep grinding (HEDG) is an important process for machining single-crystal superalloy turbine blades, whereas the severe thermo-mechanical coupling and ultrahigh strain rates involved make the evolution of subsurface residual stress difficult to predict accurately....

In-situ visualization of spatiotemporal non-uniform frosting dynamics on refrigerator evaporators under intermittent thermal-moisture shocks

Intermittent door opening introduces significant thermal and moisture shocks to household refrigerators, severely exacerbating evaporator frosting. However, the dynamic evolution of localized non-uniform frosting under these complex operating conditions remains insufficiently cha...