Zhuang Nie

Fatigue‐Resistant Mechanically Interlocked Co‐Crosslinked Polyimide Films for Reliable High‐Temperature Capacitive Energy Storage

ABSTRACT During long‐term operation, repeated thermal expansion and contraction inevitably generate cyclic thermal stresses that cause dielectric film buckling, cracking, and eventual device failure. As promising candidates for next‐generation dielectric films, polyimides (PIs) a...