You‐Yi Lin

Semi-analytical modeling and experimental measurement of elastic thermal expansion and aspect-ratio effects in Cu/SiO2 vias for 3D IC integration

Thermally induced protrusion of Cu pads embedded in SiO 2 vias is important for fine-pitch Cu/SiO 2 hybrid bonding, but its dependence on via geometry remains incompletely quantified. In this work, in situ heating atomic force microscopy (AFM) measurements at 25 and 200 °C are co...