Yimin Yao

Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management

ABSTRACT The increasing power densities of artificial intelligence and high‐performance computing (HPC) chips place stringent demands on thermal interface materials (TIMs), which are designed to combine efficient heat transport with interfacial conformability, stress relaxation,...

Multi-objective and cross-scale inverse design of temperature-control materials via physics-constrained machine learning

Abstract Temperature-control materials, notably composite phase-change materials (CPCMs), show great potential for the thermal management of next-generation power electronics. However, the synergistic optimization of multiple performance metrics still relies heavily on Edisonian...