Xueao Zhang

Tailoring the thermal conductivity of boron nitride-based materials through microstructural and architectural design for thermal management applications

The escalating power density of modern electronics has intensified the demand for thermal interface materials (TIMs) that simultaneously deliver high thermal conductivity and reliable electrical insulation. Hexagonal boron nitride (h-BN) has emerged as a leading filler candidate;...

Infrared temperature gradient microstructure mapping for optimizing filler dispersion in oriented h-BN/Al2O3/PDMS thermal interface materials

High-performance thermal interface materials require continuous heat-conduction networks, whereas filler agglomeration can disrupt heat transport and cause nonuniform heat dissipation. For h-BN/polymer composites, direct visualization of filler dispersion is challenging because o...