Xiaomeng Wu

Glass-network-dominated instability of laser modification and sidewall undulation formation in through-glass vias fabricated by laser-induced deep etching

Through-glass vias (TGVs) fabricated by femtosecond laser-induced deep etching (LIDE) are critical vertical interconnect structures for glass-based heterogeneous integration. However, severe sidewall undulation and excessive roughness remain major challenges that degrade metalliz...