Xiaoma Fei

Reprocessable, Creep‐Resistant and Fully Biobased Thermosets for Power Semiconductor Packaging

ABSTRACT Amid rapid advances in third‐generation semiconductors and holistic life‐cycle management, thermoset‐based packaging materials are evolving toward high‐temperature resistance, eco‐friendliness, and reprocessability. However, beyond the pursuit of recyclable carbon, therm...