Woonjung Kim

Poly(acrylic acid)-Containing Ceria Slurries for Shallow Trench Isolation Chemical Mechanical Polishing: Colloidal Stability, Planarization Efficiency, and Selectivity

This study reports poly(acrylic acid) (PAA)-containing ceria slurries for shallow trench isolation (STI) chemical mechanical polishing (CMP). HNU15 ceria nanoparticles were prepared by precipitation at room temperature. PAA was synthesized by aqueous free-radical polymerization,...