Vishnu; id_orcid 0009-0002-2553-823X Kizhavallil Chandrasekharan

Static ageing vs. dynamic flow in selective soldering:Mechanistic insights on iron-solder intermetallic compound formation

In selective soldering, metal nozzles are used to apply molten solder to specific areas of a printed circuit board to secure leaded components. Typically, standard iron-based nozzles are used but they wear rapidly under dynamic solder flow conditions. Fe-Sn intermetallic compound...