Tae-Gon Kim

Role of acidic and alkaline cleaning solutions on ceria removal and brush-mediated cross-contamination during post-STI CMP cleaning

Ceria-based slurries used for shallow trench isolation (STI) chemical mechanical planarization (CMP) leave residual particles that must be effectively removed during post-CMP cleaning to prevent wafer defects and cross-contamination. Although polyvinyl acetal (PVAc) brush scrubbi...