Subha Sanket Panda

Effect of Indium and Nickel on Impact Toughness of Sn–0.7Cu Solder: Interplay of Solubility, Phase Configuration, and an Improved Ductile‐to‐Brittle Transition Temperature Analysis

Reliability of solder joints under sudden mechanical shocks at cryogenic conditions is critical for deep‐space electronics, where launch‐induced vibrations, pyrotechnic‐shock, micro‐meteoroid impacts, or thermally induced stress transients can compromise structural interconnect i...