Siying He

Conversion‐Controlled Poly(Ionic Liquid)/Aluminum Nitride Thermal Interface Materials with Internal Plasticization for Reliable Chip‐Level Thermal Management

ABSTRACT The increasing power densities of artificial intelligence and high‐performance computing (HPC) chips place stringent demands on thermal interface materials (TIMs), which are designed to combine efficient heat transport with interfacial conformability, stress relaxation,...