Shanglei Chai

Hy-SAN: a hybrid shape-aware network for artifact-suppressed sparse-view computed tomography of through-silicon vias

High-throughput and non-destructive inspection of Through-Silicon Vias (TSVs) is a critical task in advanced semiconductor packaging. Sparse-view X-ray Computed Tomography (XCT) can accelerate TSV inspection but suffers from strong artefacts in analytical reconstructions and stru...