Mohamed A Mohamed

Experimental and numerical investigation of Sn–BiSAC hybrid solder joints with process optimization via Taguchi method

Purpose This study aims to use experimental, numerical and statistical methods to investigate Sn–Bi/SAC hybrid solder joints. Three solder paste compositions (Sn42Bi58, Sn42Bi57.6Ag0.4 and Sn64Bi35Ag1), stencil thicknesses, (0.08, 0.10 and 0.12 mm) and reflow temperatures (170 °C...