Ming-Ching Huang

A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding

Fan-Out Panel-Level Packaging (FO-PLP) enables high area utilization and manufacturing efficiency, but process-induced warpage caused by the coefficient of thermal expansion (CTE) mismatch and polymer shrinkage remains a major challenge. This study presents a classifier-gated hyb...