Max Mittag

FOILMET®-Interconnect-Shingling: A silver-, copper-, lead-, solder- and adhesive-free cell interconnection technology for crystalline silicon PV based on laser-joined pure aluminum foil

FOILMET®-Interconnect-Shingling (FIS) is a crystalline silicon PV cell interconnection technology that eliminates silver busbars, copper ribbons, tin-lead solder, and electrically conductive adhesive by joining a 9 µm pure aluminum foil via laser scanning. Laser Metal Bonding (LM...