Masahiro Nomura

Data-Driven Flipping Engineering for High Thermal Anisotropy in Janus Two-Dimensional Materials

Abstract The vertical integration of heterogeneous dies in three-dimensional integrated circuits demands materials with extreme thermal anisotropy to dissipate heat in-plane while suppressing cross-plane leakage. Randomly twisted van der Waals stacks can enhance anisotropy, but t...

Nanopore-Induced Thickness Independence of In-Plane Thermal Transport in Few-Layer Graphitic Carbon Nitride

Abstract Although in-plane thermal transport in many two-dimensional (2D) materials exhibits pronounced thickness dependence, it remains unclear whether this behavior persists in intrinsically porous 2D systems. In this work, we employ a scalable, high-accuracy atomistic simulati...