Marinus Hopstaken

Understanding sidewall passivation composition of single-step non-Bosch processes for deep Si etch using alternative gas mixtures

Bosch processes involving C4F8 and SF6 have been conventionally used for through-silicon via etch. However, given the high global warming potential of C4F8 and the importance of high aspect-ratio deep-Si etch processes for packaging applications in next-generation technology node...