Mahiro Matsumoto

Evaluation of Out-of-Plane Thermal Conductivity and Shear Strength of Copper Mesh/Epoxy Adhesive Film

Abstract Thermally conductive adhesives are essential thermal interface materials for high-power electronics, but achieving low out-of-plane thermal resistance while maintaining adhesive strength remains challenging. Herein, we propose a copper mesh/epoxy adhesive in which a prec...