Liu Chang

PDMS-based flexible packaging method via a 12-inch RDL-first process for conformal electronic applications

Purpose This study aims to realize large-scale and high-density manufacturing of conformal electronic devices by proposing a polydimethylsiloxane (PDMS)-based flexible packaging method via a 12-inch wafer-level redistribution-layer-first (RDL-first) process. Design/methodology/ap...