Kuo‐Ning Chiang

Role of annealed copper plasticity in process-induced warpage of SiC power modules

Substrates, such as active metal brazing (AMB) and direct bond copper (DBC), play a crucial role in the warpage performance of power modules, significantly impacting alignment precision, manufacturing yield, and long-term reliability. However, the effect of the plastic behavior o...

A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding

Fan-Out Panel-Level Packaging (FO-PLP) enables high area utilization and manufacturing efficiency, but process-induced warpage caused by the coefficient of thermal expansion (CTE) mismatch and polymer shrinkage remains a major challenge. This study presents a classifier-gated hyb...