Kausik Mukhopadhyay

Wettability and Calculated Work of Adhesion of Bi-Containing SAC305 and SAC405 Solders on ENIG and Cu-OSP Finishes

Reliable solder joint formation in electronic packaging depends on the coupled effects of solder composition and pad finish on molten solder wetting, yet direct comparisons of Bi-modified SAC305 and SAC405 solders on common surface finishes remain limited. In this study, nominal...