Jong‐Hoon Kim

Low‐Temperature Imidization of Polyimides (PI) for Scalable Manufacturing of Flexible Wearable Electronics

Polyimide (PI) is widely used in flexible electronics because of its excellent mechanical and thermal stability; however, its high imidization temperature (>200 °C) is incompatible with low‐cost polymer substrates such as polyethylene terephthalate (PET), limiting scalable rol...