Jingfeng Guo

Epoxy Composites With Improved Thermal Conductivity and Low Viscosity for Electronic Packaging via Nanodiamond‐Decorated Boron Nitride Nanosheets

ABSTRACT Electronic packaging underfill materials require high thermal conductivity (TC) and low viscosity, but combining these in epoxy (EP) remains a critical bottleneck. Prefabricated skeleton networks or high filler content enhance EP's TC yet severely compromise viscosity. T...