Jianbin Xu

Data-Driven Flipping Engineering for High Thermal Anisotropy in Janus Two-Dimensional Materials

Abstract The vertical integration of heterogeneous dies in three-dimensional integrated circuits demands materials with extreme thermal anisotropy to dissipate heat in-plane while suppressing cross-plane leakage. Randomly twisted van der Waals stacks can enhance anisotropy, but t...

Multi-objective and cross-scale inverse design of temperature-control materials via physics-constrained machine learning

Abstract Temperature-control materials, notably composite phase-change materials (CPCMs), show great potential for the thermal management of next-generation power electronics. However, the synergistic optimization of multiple performance metrics still relies heavily on Edisonian...