Gyu-Sik Park

Interfacial synergy between back‐grinding‐induced surface roughness and silane chemistry for high‐thermal‐performance DAF ‐less 3D stacking

Abstract A die attach film (DAF)‐less multi‐die stacking strategy is demonstrated for advanced three‐dimensional (3D) semiconductor packaging. Conventional DAF‐based stacking introduces a thick, low‐thermal‐conductivity polymeric interlayer that increases inter‐die spacing and im...