Dongsheng Yang

Filler‐Regulated Pore Evolution Kinetics and Reliability Enhancement Mechanism of Sintered Ag Joints Revealed by Phase‐Field Simulation

ABSTRACT Wide‐bandgap semiconductor power devices generate substantial heat, demanding reliable thermal interface materials. Pressureless sintered Ag pastes offer high melting point and excellent thermal conductivity, but their inherent high porosity degrades reliability, and the...