Dong Hee Kang

Self-focusing control for depth-precise wafer slicing of 4H-SiC in femtosecond laser processing

4H-SiC has emerged as a third-generation chip material because its superior thermal conductivity and high breakdown field enable the material to achieve high power density and higher switching frequencies in power-electronics applications. As chip architectures evolve toward 3D a...

Laser Additive Manufacturing of Copper and Its Alloys: Challenges, Process Innovations, and Future Perspectives

Abstract Copper possesses exceptional thermal and electrical conductivity, making it valuable in applications ranging from electronics and heat exchangers to aerospace and energy systems. However, its high reflectivity, thermal conductivity, and susceptibility to oxidation presen...