D. Appello

A Smart, Sensor-Augmented Probe Card for Wafer-Level Photonic Testing of Co-Packaged Optics Devices

The transition from electrical to optical interconnects, enabled by the adoption of co-packaged optics (CPO) in advanced processors, is accelerating the scale-up to high volumes and redefining wafer-level test requirements. As optical interfaces migrate closer to the compute die,...