Chase C. Tillman

High-Permeability Pulse-Reverse Electroplated NiFe for Integrated Chip-Scale Magnetic Shielding in Cryogenic Quantum Systems

Abstract Compact passive magnetic shielding at the chip and package level is essential for cryogenic quantum and superconducting systems, where even weak static magnetic fields can degrade device performance. In this work, a pulse-reverse electroplating strategy for NiFe (80:20)...