Atikah Liyana Ahamad

Experimental and numerical investigation of Sn–BiSAC hybrid solder joints with process optimization via Taguchi method

Purpose This study aims to use experimental, numerical and statistical methods to investigate Sn–Bi/SAC hybrid solder joints. Three solder paste compositions (Sn42Bi58, Sn42Bi57.6Ag0.4 and Sn64Bi35Ag1), stencil thicknesses, (0.08, 0.10 and 0.12 mm) and reflow temperatures (170 °C...