Arani Mukhopadhyay

Laser-processed wickless vapor chambers harness phase change to enable forced-air cooling of high-heat-flux electronics

Traditional electronics cooling approaches often employ fins placed directly on top of heat-generating elements (e.g. CPUs or GPUs). While such methodologies are often sufficient to handle general heat loads, they prove insufficient in scenarios that involve smaller hotspots gene...

Beyond Planar Graphene: Roughness‐Conforming Microlaminates Enable Superior Heat Removal

ABSTRACT The escalating cooling demands of high‐heat‐flux electronic systems require materials that deliver efficient heat spreading, phase‐change enhancement, and scalable manufacturability—capabilities rarely found simultaneously on a single platform. Here, we introduce a micro...